JP2511761Y2 - チップ型電子部品包装用カバ―テ―プ - Google Patents
チップ型電子部品包装用カバ―テ―プInfo
- Publication number
- JP2511761Y2 JP2511761Y2 JP1989139874U JP13987489U JP2511761Y2 JP 2511761 Y2 JP2511761 Y2 JP 2511761Y2 JP 1989139874 U JP1989139874 U JP 1989139874U JP 13987489 U JP13987489 U JP 13987489U JP 2511761 Y2 JP2511761 Y2 JP 2511761Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cover tape
- tape
- thickness
- carrier tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 4
- 239000010410 layer Substances 0.000 claims description 38
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 239000002216 antistatic agent Substances 0.000 claims description 7
- 239000004922 lacquer Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical group O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Wrappers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139874U JP2511761Y2 (ja) | 1989-12-04 | 1989-12-04 | チップ型電子部品包装用カバ―テ―プ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139874U JP2511761Y2 (ja) | 1989-12-04 | 1989-12-04 | チップ型電子部品包装用カバ―テ―プ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0378768U JPH0378768U (en]) | 1991-08-09 |
| JP2511761Y2 true JP2511761Y2 (ja) | 1996-09-25 |
Family
ID=31686891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989139874U Expired - Fee Related JP2511761Y2 (ja) | 1989-12-04 | 1989-12-04 | チップ型電子部品包装用カバ―テ―プ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511761Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003300582A (ja) * | 2002-04-09 | 2003-10-21 | Asahi Techno Plus Kk | カバーテープ |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3201507B2 (ja) * | 1995-05-30 | 2001-08-20 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ |
| JP5683096B2 (ja) * | 2009-12-09 | 2015-03-11 | 電気化学工業株式会社 | キャリアテープ体の剥離帯電量低減方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0185261U (en]) * | 1987-11-26 | 1989-06-06 | ||
| JPH0618935Y2 (ja) * | 1987-12-17 | 1994-05-18 | 住友ベークライト株式会社 | チップ型電子部品包装用カバーテープ |
-
1989
- 1989-12-04 JP JP1989139874U patent/JP2511761Y2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003300582A (ja) * | 2002-04-09 | 2003-10-21 | Asahi Techno Plus Kk | カバーテープ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0378768U (en]) | 1991-08-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |